NANOINDENTATION SIMULATION ON MECHANICAL BEHAVIOR OF NANOCRYSTALLINE Ni

Hot Nanoindentation of Nanocrystalline Ni-W Alloys

High temperature nanoindentation experiments are conducted to assess the activation enthalpy for deformation of nanocrystalline Ni-W alloys, for grain sizes between 3 and 80 nm. Thermal softening becomes less pronounced at finer grain sizes, and the activation enthalpy has an apparent inflection at a grain size near ~10-20 nm, in the vicinity the Hall-Petch breakdown. This inflection is related...

Nanoindentation and micro-mechanical fracture toughness of electrodeposited nanocrystalline Ni–W alloy films

Nanocrystalline Electroplated Cu–Ni: Metallic Thin Films with Enhanced Mechanical Properties and Tunable Magnetic Behavior

Nanocrystalline 3mm thick Cu1–xNix (0.45 £ x £ 0.87) films are electrodeposited galvanostatically onto Cu/Ti/Si (100) substrates, from a citrateand sulphate-based bath containing sodium lauryl sulphate and saccharine as additives. The films exhibit large values of reduced Young’s modulus (173< Er< 192GPa) and hardness (6.4<H< 8.2GPa), both of which can be tailored by varying the alloy compositi...

Nanoindentation study of the mechanical behavior of TiO2 nanotube arrays

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Molecular dynamics simulation of nanoindentation on Cu/Ni nanotwinned multilayer films using a spherical indenter

We performed molecular dynamics simulation of nanoindentation on Cu/Ni nanotwinned multilayer films using a spherical indenter, aimed to investigate the effects of hetero-twin interface and twin thickness on hardness. We found that both twinning partial slip (TPS) and partial slip parallel with twin boundary (PSPTB) can reduce hardness and therefore should not be ignored when evaluating mechani...